Epoxy curing agent market seen hitting $5.97 billion by 2031
Mordor Intelligence projects the global epoxy curing agent market will rise from $4.70 billion in 2026 to $5.97 billion by 2031, driven by demand in electronics, coatings, composites and 3D printing. Asia-Pacific is expected to lead growth as semiconductor packaging, wind energy and infrastructure uses expand.
Why it matters: - Epoxy curing agents sit inside products used across coatings, adhesives, composites, electronics and infrastructure. - The market’s projected rise to $5.97 billion by 2031 signals steady demand across industrial supply chains. - Growth in Asia-Pacific matters because the region is adding demand from semiconductors, wind energy and construction.
What happened: - Mordor Intelligence said the global epoxy curing agent market is projected to grow from $4.70 billion in 2026 to $5.97 billion by 2031. - The report puts the market’s compound annual growth rate at 4.87% from 2026 to 2031. - The forecast was published Sept. 18, 2026, from Hyderabad, Telangana, India. - Mordor Intelligence linked the market’s growth to expanding use of epoxy systems in protective coatings, composites, electronics and 3D printing.
The details: - Amines remain the largest product segment in the market. - Cycloaliphatic agents are gaining adoption because of faster curing and better UV resistance. - Stricter VOC rules are pushing manufacturers away from solvent-based polyamide and amine curing agents. - Waterborne and high-solids formulations are becoming more attractive, but they can create trade-offs in pot life, film thickness and formulation costs. - Fluctuating prices for epichlorohydrin and benzyl amine are pressuring producer margins. - Larger integrated suppliers are better positioned to absorb feedstock swings than smaller formulators. - Rising wind turbine blade manufacturing in Asia-Pacific and Europe is increasing demand for epoxy curing agents. - Medium-reactivity amines are commonly used in vacuum infusion for large blades because they provide enough working time. - Asia-Pacific demand is being supported by construction, data centers, electronics and semiconductor manufacturing. - China remains a major market for flooring and coatings. - India’s expanding semiconductor industry is driving demand for locally produced encapsulants. - Japan and South Korea are supporting the region through advanced sealing technologies. - North American demand is being supported by aerospace composites, infrastructure development, offshore wind and automotive manufacturing. - Modified aromatic amines are used in aerospace applications. - Recyclable curing systems are gaining attention in wind energy. - Growing vehicle production in Mexico is also supporting adhesive demand.
Between the lines: - The report points to a market shaped by both regulation and industrial growth. - VOC limits are forcing formulation changes just as electronics and wind energy are pulling demand higher. - Feedstock volatility adds a cost squeeze that may favor larger, more integrated suppliers. - The regional split suggests Asia-Pacific will stay the main growth engine while North America remains tied to aerospace, wind and autos.
What's next: - Mordor Intelligence expects continued demand growth as coatings, electronics, wind energy and infrastructure applications expand. - The company highlighted ongoing opportunities in semiconductor packaging, turbine blade manufacturing and advanced sealing systems. - The report is available in multiple languages, including Japanese, French, German and Spanish. - Recent industry moves include Brenntag and Westlake Epoxy expanding their distribution partnership into South and West India in February 2026. - Evonik launched Ancamine® 2875 in April 2026, a modified polyamine epoxy curing agent for flooring and coating applications.
The bottom line: - The epoxy curing agent market is growing steadily, but the next phase will be shaped by regulation, feedstock costs and demand from electronics and wind energy.
Disclaimer: This article was produced by AGP Wire with the assistance of artificial intelligence based on original source content and has been refined to improve clarity, structure, and readability. This content is provided on an “as is” basis. While care has been taken in its preparation, it may contain inaccuracies or omissions, and readers should consult the original source and independently verify key information where appropriate. This content is for informational purposes only and does not constitute legal, financial, investment, or other professional advice.
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